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The final presentation of Hot Chips 31 is from Microsoft, who will be lifting the lid of the silicon behind its HoloLens 2.0 product.
Doing custom x86 CPUs is nothing new: presenting one at Hot Chips is new. Here we have Tsinghua University giving a presentation on Jintide, its […]
One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel’s new Foveros technology. The first chip to use […]
One of the key competing interconnects of the future is Gen-Z, and Hewlett Packard Enterprise have a Gen-Z chipset to show at Hot Chips today.
The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC’s research […]
One of Intel’s future 10nm products is the Spring Crest NNP-I 1000 Inference Engine. Today the company is lifting the lid on some of the […]
Xilinx, the manufacturer of FPGAs, announced its new Versal AI engine last year as a way of moving FPGAs into the AI domain. This talk […]
NVIDIA announced at a VLSI conference last year that it had designed a test multi-chip solution for DNN computations. The company is explaining the technology […]