Intel: Lakefield Today, Lakefield Refresh by Holiday 2020. Possible 5G on Foveros

At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In the first talk, one of Intel’s engineers presenting at the conference said a rather curious thing that hasn’t been previously disclosed.