Day: August 25, 2020

2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package

2020-08-25 By admin

High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the industry has been the shifts towards large designs integrated into silicon interposers, directly connected to high-bandwidth-memory (HBM) stacks. TSMC has been evolving their CoWoS-S packaging technology […]

TSMC Expects 5nm to be 11% of 2020 Wafer Production (sub 16nm)

2020-08-25 By admin

One of the measures of how quickly a new process node gains traction is by comparing how many wafers are in production, especially as that new process node goes through risk production and then into high volume manufacturing. You can tell a lot about how much confidence a foundry has in its new process by […]

TSMC’s Version of EMIB is ‘LSI’: Currently in Pre-Qualification

2020-08-25 By admin

Whilst process node technologies and Moore’s Law are slowing down, manufacturers and chip designers are looking to new creative solutions to further enable device and performance scaling. Advanced packaging technologies are one such area where we’ve seen tremendous innovations over the past few years, such as the introduction of silicon interposers and integration of HBM-memory […]

TSMC Teases 12-High 3D Stacked Silicon: SoIC Goes Extreme

2020-08-25 By admin

I’ve maintained for a couple of years now that the future battleground when it comes to next-generation silicon is going to be in the interconnect – implicitly this relies on a very strong catalogue of advanced packaging techniques in order to apply those interconnects and bring chips together. As we bring those chips closer together, […]

Intel Fights BACK – Tiger Lake & New Xe GPUs Explained!

2020-08-25 By admin

[embedded content] We have a bit of an update from the folks over at Intel, they actually had a slick presentation and they gave us a little bit of insight on some stuff, including new processors, upcoming architectures, future manufacturing processes, XE graphics, their plans for datacenters, artificial intelligence, and a bunch more stuff. Instead […]

be quiet! Announces Dark Power Pro 12 PSUs: 80Plus Titanium, Up to 1500W

2020-08-25 By admin

The increasingly popular German hardware manufacturer be quiet! has announced its latest series in its ever-growing power supply line-up, the Dark Power Pro 12. Equipped with fully digital hardware and 80 PLUS Titanium certification, the be quiet! Dark Power Pro 12 power supplies will be available in capacities of 1200 and 1500 W with the […]

TSMC Updates on Node Availability Beyond Logic: Analog, HV, Sensors, RF

2020-08-25 By admin

Most of the time when we speak about semiconductor processes, we are focused on the leading edge of what is possible. Almost exclusively that leading edge is designed for logic circuitry where performance and power efficiency are key drivers of pushing the boundaries, but also there’s a strong market in it. Other markets use semiconductor […]

Increase Your Profit Potential With Margin Trading

2020-08-25 By admin

Spot trading is a popular way for investors to access the crypto market in a straightforward manner. It’s mainly fiat-to-crypto trading, as well as crypto-to-crypto trading. It’s simple, you get a crypto wallet, you buy a token with fiat currencies, and then once the price has increased, you sell the asset and make a profit. […]