As part of a broad collaborative agreement with Google, Qualcomm this week said that that it will be adopting the RISC-V instruction set architecture (ISA) for a future Snapdragon Wear platform. Working together, the two companies will be bootstrapping a RISC-V ecosystem for Wear OS devices, with Qualcomm providing the hardware while Google expands its wearables OS […]
Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative to photolithography, and can theoretically challenge extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography tools when it comes to resolution. Unlike traditional DUV and EUV photolithography […]
In what is to be the last of Intel’s processor families to use the well-established Core i9, i7, i5, and i3 naming scheme, Intel has released its 14th Generation Core series of desktop processors, aptly codenamed Raptor Lake Refresh (RPL-R). Building upon the already laid foundations of the 13th Gen Core series family, Intel has […]
Ahead of tomorrow’s full-scale launch, Intel this afternoon is pre-announcing their 14th Generation Core desktop processors. Aptly codenamed Raptor Lake Refresh, these new chips are based on Intel’s existing Raptor Lake silicon – which was used in their 13th generation chips – with Intel tapping further refinements in manufacturing and binning in order to squeeze […]
Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would then package it into a ceramic or organic encasing. Things have changed in recent years with the emergence of advanced packaging methods that require sophisticated tools […]
The performance of ultra-compact form-factor (UCFF) desktops has improved significantly since the introduction of the Intel NUC in the early 2010s. In addition to advancements in semiconductor fabrication and processor architecture, thermal solutions suitable for these 4in. x 4in. machines have also been evolving simultaneously. As a result, vendors have been able to configure higher […]
Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC’s roadshow was dedicated to the next generation of the company’s foundry technology. TSMC’s 2 nm-class N2, N2P, and N2X process technologies are set to introduce multiple innovations, including nanosheet gate-all-around (GAA) transistors, backside power delivery, and super-high-performance […]
Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company’s latest process has largely been relegated to producing tiny cryptocurrency mining chips. But it looks like things will start picking up for Samsung’s foundry business soon, as this week it was […]
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1 GT/s (the original HBM) and reaching upwards of 9 GT/s with the forthcoming HBM3E. This has made for an impressive jump in bandwidth in less than […]
This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry’s suppliers, partners, and customers to help TSMC’s customers better build innovative chips in an efficient and timely manner. The OIP program has grown over the years and now involves tens of companies and over 70,000 […]