Intel’s First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations
2024-01-25Intel this week has started production at Fab 9, the company’s latest and most advanced chip packaging plant. Joining Intel’s growing collection of facilities in New Mexico, Fab 9 is tasked with packaging chips using Intel’s Foveros technology, which is currently used to build the company’s latest client Core Ultra (Meteor Lake) processors and Data […]